TI introduces new line of functionally isolated modulators, the first of their kind in the industry 2025-04-02 New analog products from TI accurately measure currents and voltages with the highest resolution, enabling robots to perform detailed and complex tasks
Mazda and ROHM Expand Collaboration to Develop Next-Generation Automotive Components Using GaN Power Semiconductors 2025-03-31 The two companies are contributing to automotive technological innovation through the social implementation of GaN power semiconductors.
12-channel LED driver from Nexperia supports ASIL-B functional safety compliant automotive lighting designs 2025-03-27 Nexperia today introduced an AEC-Q100 qualified 12-channel, 40 V high-side LED driver integrated circuit (IC) that complies with the ASIL-B level for designing functionally safe automotive lighting
Optimize Data Center Interconnect With Lambda Splitting to Support AI Workloads 2025-03-25 Learn more about how Lambda Splitting enhances Data Center Interconnect by maximizing fiber utilization to support high-speed AI workloads. Explore our cutting-edge strategies that optimize network efficiency and reduce costs.
TI Offers 48 V Power Management Chips for AI Data Center Design 2025-03-24 TI’s hot-swap eFuse integrates needed components to handle high power demands, save space, and simplify design.
Arm Brings Generative AI to Edge Devices 2025-03-21 Arm's new Cortex-A core designed to work with Ethos microNPU extends to AI models with more than a billion parameters.
