ROHM Unveils Compact 4-in-1 and 6-in-1 SiC Molded in HSDIP20 Package for High-Efficiency EV Power Conversion

ROHM Semiconductor has introduced a new line of 4-in-1 and 6-in-1 silicon carbide (SiC) molded power modules housed in the HSDIP20 package, specifically designed to enhance PFC (Power Factor Correction) and LLC converter performance in onboard chargers (OBCs) for electric vehicles (xEVs). This series includes six 750V-rated models (BSTxxx1P4K01) and seven 1200V-rated models (BSTxxx2P4K01). By integrating all fundamental power conversion circuits into a single compact module, this lineup simplifies the design process for manufacturers while promoting the miniaturization of power conversion systems in OBCs and other high-power automotive applications.

As the automotive industry accelerates toward electrification to support a decarbonized society, the demand for higher voltage EV batteries continues to grow. This evolution is driven by the need for extended driving ranges and faster charging capabilities, which in turn require more powerful OBC and DC-DC converter solutions. Simultaneously, the market calls for reduced system size and weight, prompting a need for innovations that boost power density without compromising thermal performance. ROHM’s HSDIP20 SiC modules are engineered to address these critical technical demands—surpassing the limitations of conventional discrete component designs—while advancing both system downsizing and higher output performance in modern electric powertrains.

A key differentiator of the HSDIP20 package is its insulating substrate, which delivers exceptional heat dissipation. This thermal efficiency significantly limits chip temperature rise during high-power operation. When benchmarked against a typical PFC OBC circuit utilizing six discrete SiC MOSFETs with top-side cooling, ROHM’s 6-in-1 HSDIP20 module demonstrated a temperature reduction of approximately 38°C under 25W operating conditions. This superior cooling capability allows the compact module to handle high currents while delivering a best-in-class power density, exceeding that of top-side cooled discrete solutions by more than threefold and outperforming comparable DIP-style modules by over 1.4 times.

In practical terms, this results in dramatic space savings: the HSDIP20 package can reduce the mounting area of the PFC circuit by around 52% compared to configurations based on discrete top-side cooled devices. This benefit is a major enabler of circuit miniaturization in high-efficiency power conversion systems, such as OBCs for electric vehicles.

Looking ahead, ROHM remains committed to advancing its SiC module technology, with a dual focus on achieving both greater compactness and energy efficiency. The company is also actively developing automotive-grade SiC intelligent power modules (IPMs) that combine increased reliability with a reduced footprint, further supporting the evolution of next-generation electric vehicle platforms.