TDK Integrates Comprehensive Telemetry into its Latest DC-DC Converter Modules for High Power-Density Applications 2025-03-19 The FS1606 is the most compact 6A solution in the series, featuring full telemetry via an I²C interface within a 3.3 x 3.3 x 1.35 mm package.
Mazda and ROHM Expand Collaboration to Develop Next-Generation Automotive Components Using GaN Power Semiconductors 2025-03-31 The two companies are contributing to automotive technological innovation through the social implementation of GaN power semiconductors.
MIT, UCLA, and Harvard Discover New Ways to Harvest the Power of Light 2025-04-07 New photonic devices are testing the bounds of optical technology, from creating direct quantum links to achieving one-way light control.
ST and Innoscience sign GaN power device technology development and manufacturing agreement 2025-04-08 STMicroelectronics of Geneva, Switzerland and InnoScience (Suzhou) Technology Holding Co Ltd - which manufactures gallium nitride (GaN) power chips
ALD Introduces New SAB MOSFET for Efficient Supercapacitor Balancing and Power Management 2025-04-10 ALD’s new SAB MOSFET achieves higher power management standards for supercapacitors rated 3V or more.
Diodes Inc adds 650V SiC Schottky diodes with low figure-of-merit 2025-04-17 Power semiconductor product supplier Diodes Inc of Plano, TX, USA has expanded its silicon carbide (SiC) product portfolio with a series of five high-performance, low figure-of-merit (FOM) 650V SiC Schottky diodes.
