Infineon releases first silicon carbide products to customers based on 200mm silicon carbide wafers 2025-02-15 Infineon Technologies AG of Munich, Germany says that it has made significant progress on its 200mm silicon carbide (SiC) roadmap, and is releasing the first products based on the 200mm SiC technology to customers in first-quarter 2025.
TDK Corporation Expands the TDK-Lambda Brand CCG Series with Two New Options for 1.5W to 10W Isolated DC-DC Converters 2025-02-24 The new 1.5W to 10W DC-DC converters feature an optional two-sided board coating for enhanced durability in harsh industrial environments.
Industry’s first space-grade 200V GaN FET gate driver from TI helps satellites become smaller and more efficient 2025-02-25 Ranging from 22V to 200V and supporting different radiation levels, TI’s new family of gate drivers enables designers to improve power system efficiency for every type of space mission
KYOCERA AVX Offers SpiSCAP, a Supercapacitor Simulation Tool 2025-02-26 Kyocera AVX's SpiSCAP simulation tool simplifies the supercapacitor selection process for optimized power management across industries.
Finwave announces global distribution agreement with RFMW 2025-03-04 Representing a step in its evolution from a technology-driven company to a product-driven company
