TDK Integrates Comprehensive Telemetry into its Latest DC-DC Converter Modules for High Power-Density Applications

TDK Corporation has introduced the FS160* series of microPOL (μPOL) power modules, delivering exceptional power density and full telemetry in ultra-compact sizes now in mass production. These μPOL DC-DC converters offer enhanced performance while maintaining a remarkably small footprint.

Each FS160* module measures just 3.3 mm x 3.3 mm x 1.35 mm, making them ideal for integration into designs featuring ASICs, SoCs, and leading FPGAs. The series provides full telemetry—including voltage, current, and temperature monitoring—accessible via an I²C interface. Designed to operate across a wide junction temperature range from -40 °C to 125 °C, these modules ensure reliability in demanding environments.

The FS160* series includes multiple variants: the FS1603 (3 A), FS1604 (4 A), and FS1606 (6 A), along with higher-current models such as the FS1412 (12 A) and FS1525 (25 A). By paralleling up to eight FS1525 modules, the series can scale up to 200 A, covering applications ranging from big data and AI to 5G, IoT, and enterprise computing.

TDK’s innovative module design integrates a high-performance controller, drivers, MOSFETs, and a logic core within a semiconductor-embedded substrate, eliminating wire bonds and enhancing thermal performance. Additionally, the modules incorporate an IC inductor and passive components within a chip-embedded package, minimizing parasitic inductance and interconnect resistance. This leads to higher efficiency, faster response times, and precise voltage regulation under dynamic loads. Boot and Vcc capacitors are also integrated to further optimize performance.

Thanks to these advancements, FS160* series converters achieve an industry-leading power density of 1 watt per cubic millimeter, offering modules nearly half the size of comparable solutions. Their superior thermal performance enables operation without airflow for up to 15 W to 30 W, even in ambient temperatures reaching 100 °C. Ultimately, TDK’s μPOL modules help designers reduce PCB footprint, simplify layouts, and lower overall system costs while delivering high-efficiency power conversion.