ROHM Introduces 650V GaN HEMT in Compact TOLL Package with Excellent Heat Dissipation 2025-02-28 ROHM is speeding up development to bring GaN devices into mass production for automotive applications.
Mazda and ROHM Expand Collaboration to Develop Next-Generation Automotive Components Using GaN Power Semiconductors 2025-03-31 The two companies are contributing to automotive technological innovation through the social implementation of GaN power semiconductors.
ROHM Unveils Compact 4-in-1 and 6-in-1 SiC Molded in HSDIP20 Package for High-Efficiency EV Power Conversion 2025-04-25 ROHM Semiconductor has introduced a new line of 4-in-1 and 6-in-1 silicon carbide (SiC) molded power modules housed in the HSDIP20 package.
