Optimize Data Center Interconnect With Lambda Splitting to Support AI Workloads 2025-03-25 Learn more about how Lambda Splitting enhances Data Center Interconnect by maximizing fiber utilization to support high-speed AI workloads. Explore our cutting-edge strategies that optimize network efficiency and reduce costs.
TI Offers 48 V Power Management Chips for AI Data Center Design 2025-03-24 TI’s hot-swap eFuse integrates needed components to handle high power demands, save space, and simplify design.
Arm Brings Generative AI to Edge Devices 2025-03-21 Arm's new Cortex-A core designed to work with Ethos microNPU extends to AI models with more than a billion parameters.
Renesas Introduces Comprehensive Lithium-Ion Battery Management Solution with Pre-Tested Firmware 2025-03-20 The offer includes fuel gauge ICs, MCU, pre-tested firmware, software, and documentation to streamline battery pack development.
TDK Integrates Comprehensive Telemetry into its Latest DC-DC Converter Modules for High Power-Density Applications 2025-03-19 The FS1606 is the most compact 6A solution in the series, featuring full telemetry via an I²C interface within a 3.3 x 3.3 x 1.35 mm package.
Infineon Launches the E-version of its XDP™ Hybrid Flyback Controller ICs 2025-03-18 After pioneering the industry’s first power factor correction (PFC) and hybrid flyback (HFB) combo IC, Infineon Technologies AG is now expanding its portfolio by introducing the E-version of its hybrid flyback controller family.
