Industry’s first space-grade 200V GaN FET gate driver from TI helps satellites become smaller and more efficient 2025-02-25 Ranging from 22V to 200V and supporting different radiation levels, TI’s new family of gate drivers enables designers to improve power system efficiency for every type of space mission
Intel Expands Tiber Trust Services Portfolio to Combat Evolving Threats 2025-03-14 Today, Intel announced the expansion of its Intel® Tiber™ Trust Services portfolio, a comprehensive suite of solutions designed to provide enterprises with unparalleled trust and security across complex modern application architectures.
Nexperia Launches High Signal Integrity ESD Diodes in Advanced Flip-Chip LGA Packages for Automotive Applications 2025-04-11 Innovative FC-LGA packages provide exceptional RF performance and comply with automotive requirements, featuring the industry’s first side-wettable flank options.
Imec’s 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demos record low insertion loss at frequencies up to 325GHz 2025-05-28 At the IEEE’s 75th Electronic Components and Technology Conference (ECTC 2025) in Dallas, TX, USA (27–30 May), nanoelectronics research center imec of Leuven.
U.S. Tariffs, Bans Could Halt Chip Industry Growth 2025-06-03 Chipmakers TSMC, Intel and Micron publicly replied to a U.S. Department of Commerce inquiry on the national-security impact of tariffs.
