Nexperia Launches High Signal Integrity ESD Diodes in Advanced Flip-Chip LGA Packages for Automotive Applications

Nexperia has introduced a new range of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes housed in advanced flip-chip land-grid-array (FC-LGA) packaging. This cutting-edge package design is tailored for the protection and filtering of high-speed data communication links, which are becoming more prevalent in today’s automotive systems. It is ideally suited for safeguarding in-vehicle camera video links, high-bandwidth automotive Ethernet networks, and infotainment connections such as USBx, HDMIx, and PCIex from potentially harmful ESD events.

Flip-chip technology minimizes parasitic elements by eliminating the need for bond wires and copper lead frames, thereby delivering exceptional signal integrity and high performance. The newly released 2- and 3-pin FC-LGA diodes from Nexperia boast ultra-low capacitance (below 0.25 pF) and minimal insertion loss (-3 dB at 14.6 GHz), both of which are critical features for high-speed data applications. These flip-chip variants—the 2-pin DFN1006L(D)-2 and the 3-pin DFN1006L(D)-3—share identical footprints with their standard equivalents, offering seamless drop-in compatibility. Compared to traditional DFN technologies, they deliver a bandwidth improvement of up to 6 GHz. Additionally, the 3-pin versions support dual-channel protection and capacitance matching, optimizing board space usage while enhancing overall circuit performance and signal stability.

In addition to their industry-leading signal integrity, this diode family includes the broadest selection of reverse working voltages (Vrwm) in the market, with variants rated at 5 V, 18 V, 24 V, and 30 V. Higher voltage options enable greater flexibility in board design, allowing protection of multiple connected components at various points along a communication link. Nexperia also distinguishes itself as the only supplier offering ESD protection diodes in flip-chip format with side-wettable flanks (SWF)—as featured in products like the PESD5V0H1BLG-Q (DFN1006LD-2) and PESD5V0H2BFG-Q (DFN1006LD-3). This feature facilitates automated optical inspection (AOI) of solder joints, helping ensure compliance with the rigorous quality standards demanded by the automotive sector, where safety is a top priority.

Currently, the first batch of 5 V Flip-Chip diodes has entered mass production, while six additional products rated at 18 V, 24 V, and 30 V are in the sampling phase, with full-scale production scheduled for Q2 2025.