2-382719-1
TE Connectivity AMP Connectors
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 30POS TIN
$2.26
Available to order
Reference Price (USD)
1+
$2.26000
500+
$2.2374
1000+
$2.2148
1500+
$2.1922
2000+
$2.1696
2500+
$2.147
Exquisite packaging
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TE Connectivity AMP Connectors 2-382719-1 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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2-382719-1
$2.26
Product details
The 2-382719-1 by TE Connectivity AMP Connectors delivers precision connectivity for ICs and transistors in compact, high-density applications. This innovative socket features micro-precision contacts that maintain excellent electrical characteristics even after thousands of mating cycles. Its low-profile design makes it perfect for space-constrained applications in mobile devices, wearable technology, and miniaturized industrial controls. The 2-382719-1 offers superior resistance to mechanical stress and thermal cycling, ensuring reliable performance in challenging conditions. Engineers appreciate its compatibility with automated assembly processes, reducing production time and costs. This socket finds ideal applications in smart home devices, portable medical equipment, and drone technology where size and reliability are critical factors. TE Connectivity AMP Connectors's quality control processes guarantee consistent performance across all production batches, giving you peace of mind for your high-volume requirements. The 2-382719-1 represents the perfect marriage of miniaturization and robustness in interconnect solutions. Don't let space limitations compromise your design explore how this advanced socket can solve your connectivity challenges. Request a quote today to start your evaluation process.
General specs
- Product Status: Obsolete
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 30 (2 x 15)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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