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8080-1G15

TE Connectivity AMP Connectors
8080-1G15 Preview
TE Connectivity AMP Connectors
CONN TRANSIST TO-3 3POS TIN-LEAD
$16.28
Available to order
Reference Price (USD)
1+
$12.91000
10+
$11.73200
25+
$11.43880
50+
$10.55880
100+
$9.97230
250+
$9.09236
500+
$8.50578
1,000+
$7.80185
Exquisite packaging
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TNT 2-6 days
EMS 3-7 days

TE Connectivity AMP Connectors 8080-1G15 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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8080-1G15

8080-1G15

$16.28

Product details

The 8080-1G15 by TE Connectivity AMP Connectors redefines reliability in IC and transistor sockets, offering cutting-edge technology for modern electronic applications. This precision-engineered socket features gold-plated contacts for optimal conductivity and corrosion resistance, ensuring long-term performance stability. Its unique design accommodates various package types while maintaining consistent contact pressure across all pins. The 8080-1G15 excels in applications requiring high-speed data transmission and minimal signal loss, such as server farms, 5G infrastructure, and advanced computing systems. Additional benefits include easy visual inspection points and color-coded orientation indicators for foolproof installation. Manufactured to withstand rigorous use, this socket is equally at home in laboratory equipment, marine electronics, and agricultural automation systems. TE Connectivity AMP Connectors's commitment to innovation shines through in every detail of the 8080-1G15, providing engineers with a trusted solution for their most demanding projects. Don't settle for ordinary sockets explore the advanced features of the 8080-1G15 today. Click to request a sample or get instant pricing information from our sales team.

General specs

  • Product Status: Active
  • Type: Transistor, TO-3
  • Number of Positions or Pins (Grid): 3 (Oval)
  • Pitch - Mating: -
  • Contact Finish - Mating: Tin-Lead
  • Contact Finish Thickness - Mating: 200.0µin (5.08µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Chassis Mount
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 200.0µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Fluoropolymer (FP)
  • Operating Temperature: -55°C ~ 125°C

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