Infineon releases first silicon carbide products to customers based on 200mm silicon carbide wafers 2025-02-15 Infineon Technologies AG of Munich, Germany says that it has made significant progress on its 200mm silicon carbide (SiC) roadmap, and is releasing the first products based on the 200mm SiC technology to customers in first-quarter 2025.
Mazda and ROHM Expand Collaboration to Develop Next-Generation Automotive Components Using GaN Power Semiconductors 2025-03-31 The two companies are contributing to automotive technological innovation through the social implementation of GaN power semiconductors.
Infineon and Visteon collaborate on power conversion systems for EVs 2025-05-12 Infineon Technologies AG of Munich, Germany and automotive cockpit electronics supplier Visteon Corp of Van Buren Township, MI, USA have signed a memorandum of understanding (MOU) to advance the development of next-generation electric vehicle powertrains.
Infineon Advances GaN Leadership with Scalable 300mm Wafer Manufacturing Milestone 2025-07-03 Infineon’s manufacturing strategy primarily relies on an IDM model, controlling the entire semiconductor process from design to final product delivery.
