XCZU7EG-3FBVB900E
AMD Xilinx

AMD Xilinx
IC SOC CORTEX-A53 900FCBGA
$4,935.99
Available to order
Reference Price (USD)
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$4,113.12000
Exquisite packaging
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AMD Xilinx XCZU7EG-3FBVB900E is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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Product details
The XCZU7EG-3FBVB900E from AMD Xilinx is a next-generation System on Chip (SoC) designed for advanced embedded systems. Combining high computational power with energy efficiency, this SoC is perfect for applications requiring both performance and low power usage. It features integrated memory controllers, high-speed peripherals, and robust security modules. The XCZU7EG-3FBVB900E is ideal for use in automotive infotainment, industrial IoT, and consumer electronics. Its scalable architecture allows for easy integration into existing systems, while its durable design ensures long-term reliability. Whether you're developing AI applications, network infrastructure, or portable devices, this SoC delivers the performance you need. Key benefits include enhanced data processing, seamless connectivity, and superior thermal management. Explore the possibilities of the XCZU7EG-3FBVB900E in smart appliances, medical diagnostics, and communication systems. For pricing and technical support, contact our team or visit our online store.
General specs
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 667MHz, 1.5GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)