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XCZU5EG-3FBVB900E

AMD Xilinx
XCZU5EG-3FBVB900E Preview
AMD Xilinx
IC SOC CORTEX-A53 900FCBGA
$4,078.68
Available to order
Reference Price (USD)
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$3,398.49000
Exquisite packaging
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XCZU5EG-3FBVB900E

XCZU5EG-3FBVB900E

$4,078.68

Product details

Enhance your embedded systems with the XCZU5EG-3FBVB900E from AMD Xilinx, a feature-rich System on Chip (SoC) designed for high-performance applications. This SoC integrates a multicore processor with advanced acceleration units, delivering unparalleled processing power. Its low-latency design ensures real-time responsiveness, critical for time-sensitive applications. The XCZU5EG-3FBVB900E offers extensive connectivity options, including high-speed interfaces and wireless capabilities. With its robust security features, this SoC is perfect for secure communications and data protection. Ideal for use in autonomous vehicles, smart appliances, and industrial IoT, the XCZU5EG-3FBVB900E provides the reliability and performance you need. Its flexible architecture supports a variety of development environments, reducing time-to-market. Discover how this SoC can transform your projects in aerospace, healthcare monitoring, and energy management systems. To learn more about the XCZU5EG-3FBVB900E and to place an order, submit your inquiry online today.

General specs

  • Product Status: Active
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)

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