XCZU17EG-3FFVD1760E
AMD Xilinx
AMD Xilinx
IC SOC CORTEX-A53 1760FCBGA
$11,518.95
Available to order
Reference Price (USD)
1+
$9,598.92000
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
| DHL / Fedex / UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
AMD Xilinx XCZU17EG-3FFVD1760E is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
Experience hassle-free transactions with our flexible payment options and credit facilities. Learn more about the various payment methods accepted, installment plans, and any exclusive credit offers available to make your shopping experience seamless.
XCZU17EG-3FFVD1760E
$11,518.95
Product details
Discover the XCZU17EG-3FFVD1760E from AMD Xilinx, a cutting-edge System on Chip (SoC) tailored for embedded systems requiring high reliability and performance. This SoC combines a powerful CPU with integrated peripherals, offering a complete solution for diverse applications. Its energy-efficient design minimizes power usage while maximizing processing power. The XCZU17EG-3FFVD1760E features advanced security mechanisms, ensuring data integrity and protection. Ideal for use in enterprise servers, networking equipment, and multimedia devices, this SoC provides the flexibility and scalability you need. Its robust construction and long lifecycle make it suitable for industrial and commercial applications. Learn how the XCZU17EG-3FFVD1760E can benefit your projects in virtual reality, surveillance systems, and portable medical devices. To get started, request a quote or consult with our technical experts for personalized support.
General specs
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 667MHz, 1.5GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (42.5x42.5)
Viewed products