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XCZU11EG-3FFVC1760E

AMD Xilinx
XCZU11EG-3FFVC1760E Preview
AMD Xilinx
IC SOC CORTEX-A53 1760FCBGA
$9,186.87
Available to order
Reference Price (USD)
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$7,655.52000
Exquisite packaging
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XCZU11EG-3FFVC1760E

XCZU11EG-3FFVC1760E

$9,186.87

Product details

Enhance your embedded systems with the XCZU11EG-3FFVC1760E from AMD Xilinx, a feature-rich System on Chip (SoC) designed for high-performance applications. This SoC integrates a multicore processor with advanced acceleration units, delivering unparalleled processing power. Its low-latency design ensures real-time responsiveness, critical for time-sensitive applications. The XCZU11EG-3FFVC1760E offers extensive connectivity options, including high-speed interfaces and wireless capabilities. With its robust security features, this SoC is perfect for secure communications and data protection. Ideal for use in autonomous vehicles, smart appliances, and industrial IoT, the XCZU11EG-3FFVC1760E provides the reliability and performance you need. Its flexible architecture supports a variety of development environments, reducing time-to-market. Discover how this SoC can transform your projects in aerospace, healthcare monitoring, and energy management systems. To learn more about the XCZU11EG-3FFVC1760E and to place an order, submit your inquiry online today.

General specs

  • Product Status: Active
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 667MHz, 1.5GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)

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