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XCVM1802-2MLIVFVC1760

AMD Xilinx
XCVM1802-2MLIVFVC1760 Preview
AMD Xilinx
IC VERSAL AICORE FPGA 1760BGA
$15,772.29
Available to order
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XCVM1802-2MLIVFVC1760

XCVM1802-2MLIVFVC1760

$15,772.29

Product details

Discover the XCVM1802-2MLIVFVC1760 from AMD Xilinx, a high-performance System on Chip (SoC) designed for advanced embedded applications. This versatile SoC integrates multiple processing cores, enabling seamless multitasking and efficient power management. Ideal for complex computing tasks, it offers robust connectivity options and supports various peripheral interfaces. The XCVM1802-2MLIVFVC1760 is engineered to deliver reliable performance in demanding environments, making it a perfect choice for modern embedded systems. With its compact design and low power consumption, this SoC is optimized for space-constrained and energy-efficient applications. Whether you're developing IoT devices, industrial automation systems, or consumer electronics, the XCVM1802-2MLIVFVC1760 provides the flexibility and scalability you need. Key features include advanced security protocols, real-time processing capabilities, and extensive memory support. Explore the potential of this SoC in automotive infotainment, smart home devices, and medical equipment. Ready to integrate the XCVM1802-2MLIVFVC1760 into your next project? Contact us today for pricing and availability.

General specs

  • Product Status: Active
  • Architecture: MPU, FPGA
  • Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.4GHz
  • Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BFBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (40x40)

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