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XCVM1802-2MLEVFVC1760

AMD Xilinx
XCVM1802-2MLEVFVC1760 Preview
AMD Xilinx
IC VERSAL AICORE FPGA 1760BGA
$12,617.34
Available to order
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XCVM1802-2MLEVFVC1760

XCVM1802-2MLEVFVC1760

$12,617.34

Product details

Enhance your embedded systems with the XCVM1802-2MLEVFVC1760 from AMD Xilinx, a feature-rich System on Chip (SoC) designed for high-performance applications. This SoC integrates a multicore processor with advanced acceleration units, delivering unparalleled processing power. Its low-latency design ensures real-time responsiveness, critical for time-sensitive applications. The XCVM1802-2MLEVFVC1760 offers extensive connectivity options, including high-speed interfaces and wireless capabilities. With its robust security features, this SoC is perfect for secure communications and data protection. Ideal for use in autonomous vehicles, smart appliances, and industrial IoT, the XCVM1802-2MLEVFVC1760 provides the reliability and performance you need. Its flexible architecture supports a variety of development environments, reducing time-to-market. Discover how this SoC can transform your projects in aerospace, healthcare monitoring, and energy management systems. To learn more about the XCVM1802-2MLEVFVC1760 and to place an order, submit your inquiry online today.

General specs

  • Product Status: Active
  • Architecture: MPU, FPGA
  • Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.4GHz
  • Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BFBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (40x40)

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