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8080-1G24

TE Connectivity AMP Connectors
8080-1G24 Preview
TE Connectivity AMP Connectors
CONN SOCKET TRANSIST TO-3 3POS
$16.33
Available to order
Reference Price (USD)
1+
$12.95000
10+
$11.77200
25+
$11.47800
50+
$10.59500
100+
$10.00640
250+
$9.12348
500+
$8.53486
1,000+
$7.82853
Exquisite packaging
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TNT 2-6 days
EMS 3-7 days

TE Connectivity AMP Connectors 8080-1G24 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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8080-1G24

8080-1G24

$16.33

Product details

Experience superior connectivity with the 8080-1G24 from TE Connectivity AMP Connectors, a high-grade socket specifically designed for ICs and transistors. This socket delivers exceptional electrical performance and mechanical stability, ensuring uninterrupted operation in even the most challenging environments. Its advanced contact technology guarantees low insertion force and high retention, protecting your components during installation and use. The 8080-1G24 stands out with its resistance to vibration, temperature fluctuations, and chemical exposure, making it suitable for automotive control systems, industrial machinery, and IoT devices. The socket's innovative design allows for quick component changes, significantly reducing assembly time. Backed by TE Connectivity AMP Connectors's quality assurance, the 8080-1G24 meets the highest industry standards for reliability and performance. Whether you're developing new products or maintaining existing systems, this socket offers the perfect balance of functionality and durability. Ready to source this essential component? Submit your inquiry now and our team will provide customized solutions for your specific requirements.

General specs

  • Product Status: Active
  • Type: Transistor, TO-3
  • Number of Positions or Pins (Grid): 3 (Round)
  • Pitch - Mating: -
  • Contact Finish - Mating: Tin-Lead
  • Contact Finish Thickness - Mating: 20.0µin (0.51µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Chassis Mount
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 20.0µin (0.51µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Diallyl Phthalate (DAP)
  • Operating Temperature: -55°C ~ 125°C

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