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2357798-3

TE Connectivity AMP Connectors
2357798-3 Preview
TE Connectivity AMP Connectors
16G,05FH,PLUG,22OP 8H 8U"AU T&R,
$32.84
Available to order
Reference Price (USD)
1+
$32.84000
500+
$32.5116
1000+
$32.1832
1500+
$31.8548
2000+
$31.5264
2500+
$31.198
Exquisite packaging
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TE Connectivity AMP Connectors 2357798-3 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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2357798-3

2357798-3

$32.84

Product details

The 2357798-3 from TE Connectivity AMP Connectors represents a premium edge-type mezzanine connector solution for critical board-to-board applications. This rectangular array connector delivers exceptional signal integrity and power transmission in compact electronic assemblies. Its advanced contact geometry ensures reliable connections in medical imaging systems, semiconductor test equipment, and industrial control units. The connector's robust construction withstands mechanical stress in transportation and aerospace electronics. Features include enhanced current-carrying capacity, optimized contact resistance, and vibration-resistant mating interfaces. The 2357798-3 supports high-speed data transmission while maintaining excellent EMI/RFI shielding characteristics. Its modular design allows flexible configuration for different stack heights and pin counts. Common implementations include server backplane connections, power supply modules, and instrumentation clusters. The connector's durable materials ensure long-term reliability in challenging operating environments. For technical specifications and application support regarding this high-performance interconnect solution, please complete our online inquiry form.

General specs

  • Product Status: Active
  • Connector Type: Plug, Outer Shroud Contacts
  • Number of Positions: 220
  • Pitch: 0.020" (0.50mm)
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • Features: Board Guide, Ground Plate, Solder Retention
  • Contact Finish: Gold
  • Contact Finish Thickness: 8.00µin (0.203µm)
  • Mated Stacking Heights: 8mm
  • Height Above Board: 0.293" (7.45mm)

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