SM662PBE BFSS
Silicon Motion, Inc.
Silicon Motion, Inc.
IC FLASH 640GBIT EMMC 153BGA
$94.11
Available to order
Reference Price (USD)
1+
$94.11000
500+
$93.1689
1000+
$92.2278
1500+
$91.2867
2000+
$90.3456
2500+
$89.4045
Exquisite packaging
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| EMS | 3-7 days |
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SM662PBE BFSS
$94.11
Product details
The SM662PBE BFSS by Silicon Motion, Inc. represents the next generation of memory IC technology, offering unparalleled performance for data-intensive applications. This memory solution combines high density with rapid access capabilities, providing system designers with flexible options for various architectural requirements. Its advanced interface ensures compatibility with modern processors and controllers.
Notable features include enhanced security protocols to protect sensitive data, multi-level cell technology for efficient storage, and adaptive power management for energy-sensitive applications. The SM662PBE BFSS demonstrates exceptional endurance characteristics, making it suitable for applications with frequent read/write cycles. Its architecture supports seamless scaling for future system upgrades.
This memory IC finds perfect application in AI accelerator cards, high-performance computing clusters, and data center storage arrays. It's equally effective in automotive ADAS systems, 5G network infrastructure, and industrial robotics requiring real-time data processing. The SM662PBE BFSS also serves well in advanced medical imaging equipment and scientific instrumentation.
To explore how this Silicon Motion, Inc. memory IC can optimize your design, submit your inquiry through our digital platform. We offer comprehensive support from technical consultation to volume pricing for the SM662PBE BFSS memory solution.
General specs
- Product Status: Active
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Technology: FLASH - NAND (SLC), FLASH - NAND (TLC)
- Memory Size: 640Gb (80G x 8)
- Memory Interface: eMMC
- Clock Frequency: -
- Write Cycle Time - Word, Page: -
- Access Time: -
- Voltage - Supply: -
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 153-TFBGA
- Supplier Device Package: 153-BGA (11.5x13)
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