SM662PAC BFST
Silicon Motion, Inc.
Silicon Motion, Inc.
IC FLASH 512GBIT EMMC 153BGA
$25.91
Available to order
Reference Price (USD)
1+
$25.91000
500+
$25.6509
1000+
$25.3918
1500+
$25.1327
2000+
$24.8736
2500+
$24.6145
Exquisite packaging
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| EMS | 3-7 days |
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SM662PAC BFST
$25.91
Product details
Discover the SM662PAC BFST by Silicon Motion, Inc., a high-efficiency memory IC engineered for next-generation computing platforms. This innovative solution delivers superior performance metrics, combining speed, capacity, and power optimization in a single package. Its architecture is tailored for both embedded and expandable memory applications.
The SM662PAC BFST features include dynamic frequency scaling, bank interleaving support, and thermal throttling capability. These advanced features enable optimal performance across various operating conditions. The memory IC offers excellent signal integrity at high speeds while maintaining low power consumption. Its design incorporates reliability enhancements for continuous operation.
Ideal applications include hyperscale data centers, AI inference accelerators, and autonomous mobile robots. The SM662PAC BFST is equally effective in virtual reality systems, genomic sequencing equipment, and quantum computing interfaces. Its capabilities extend to smart agriculture systems and renewable energy management platforms requiring high-performance memory solutions.
To learn more about integrating this Silicon Motion, Inc. memory IC into your design, submit your inquiry through our online portal. Our application engineers will provide technical support and procurement options for the SM662PAC BFST, ensuring optimal memory performance for your specific requirements.
General specs
- Product Status: Active
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Technology: FLASH - NAND (TLC)
- Memory Size: 512Gb (64G x 8)
- Memory Interface: eMMC
- Clock Frequency: -
- Write Cycle Time - Word, Page: -
- Access Time: -
- Voltage - Supply: -
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 153-TFBGA
- Supplier Device Package: 153-BGA (11.5x13)
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