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SEAMP-30-02.0-L-06

Samtec Inc.
SEAMP-30-02.0-L-06 Preview
Samtec Inc.
CONN HD ARRAY M 180POS PRESS-FIT
$17.04
Available to order
Reference Price (USD)
1+
$17.04364
500+
$16.8732036
1000+
$16.7027672
1500+
$16.5323308
2000+
$16.3618944
2500+
$16.191458
Exquisite packaging
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Samtec Inc. SEAMP-30-02.0-L-06 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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SEAMP-30-02.0-L-06

SEAMP-30-02.0-L-06

$17.04

Product details

Samtec Inc.'s SEAMP-30-02.0-L-06 edge-type mezzanine connector delivers uncompromising performance in demanding board-to-board applications. This rectangular array solution combines high contact density with reliable power distribution capabilities. The precision-engineered contact system ensures minimal insertion loss and stable impedance characteristics. Suitable for high-vibration environments, the connector maintains secure connections in transportation systems and heavy machinery electronics. Its robust construction meets rigorous industrial standards for shock and impact resistance. The SEAMP-30-02.0-L-06 finds extensive use in energy management systems, industrial computing platforms, and defense electronics. The connector's optimized pin arrangement supports mixed-signal transmission with effective noise isolation. Key benefits include extended service life, simplified assembly processes, and compatibility with automated placement equipment. For applications requiring dependable inter-board connections in harsh conditions, this connector series provides proven solutions. Access technical documentation and request samples by completing our brief online inquiry form.

General specs

  • Product Status: Active
  • Connector Type: High Density Array, Male
  • Number of Positions: 180
  • Pitch: 0.050" (1.27mm)
  • Number of Rows: 6
  • Mounting Type: Through Hole
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 100.0µin (2.54µm)
  • Mated Stacking Heights: 7mm
  • Height Above Board: 0.181" (4.60mm)

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