SEAFP-30-05.0-L-06
Samtec Inc.
Samtec Inc.
CONN HD ARRAY F 180POS PRESS-FIT
$15.73
Available to order
Reference Price (USD)
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$15.72569
500+
$15.5684331
1000+
$15.4111762
1500+
$15.2539193
2000+
$15.0966624
2500+
$14.9394055
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SEAFP-30-05.0-L-06
$15.73
Product details
The SEAFP-30-05.0-L-06 rectangular array connector by Samtec Inc. provides superior edge-type mezzanine connectivity for advanced electronic systems. Designed for board-to-board applications, this high-density solution ensures reliable signal transmission and power delivery. Its innovative contact design maintains stable electrical characteristics in industrial robotics, process control equipment, and test measurement systems. The connector's robust construction withstands harsh environmental conditions encountered in transportation and energy applications. Features include enhanced EMI shielding, vibration-resistant mating interfaces, and optimized current-carrying capacity. The SEAFP-30-05.0-L-06 supports various stack heights between parallel boards, offering design flexibility for different system architectures. Its space-saving profile facilitates thermal management in densely packed electronic assemblies. Common implementations include server backplanes, power supply modules, and instrumentation clusters. For OEMs requiring consistent interconnect performance, this solution offers reliable alternatives to conventional board stacking methods. Submit your project requirements through our online inquiry system to receive customized connector recommendations.
General specs
- Product Status: Active
- Connector Type: High Density Array, Female
- Number of Positions: 180
- Pitch: 0.050" (1.27mm)
- Number of Rows: 6
- Mounting Type: Through Hole
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 100.0µin (2.54µm)
- Mated Stacking Heights: 7mm
- Height Above Board: 0.197" (5.00mm)
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