QRF8-078-05.0-L-D-A-GP
Samtec Inc.
Samtec Inc.
CONN ARRAY RCPT 156POS SMD GOLD
$26.05
Available to order
Reference Price (USD)
1+
$13.49000
10+
$13.03600
32+
$12.58594
64+
$12.13656
128+
$11.68703
256+
$11.46227
512+
$11.23750
Exquisite packaging
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| EMS | 3-7 days |
Samtec Inc. QRF8-078-05.0-L-D-A-GP is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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QRF8-078-05.0-L-D-A-GP
$26.05
Product details
The QRF8-078-05.0-L-D-A-GP board-to-board connector by Samtec Inc. sets new standards in rectangular array interconnect technology. Designed for edge-type mezzanine applications, this high-density solution enables reliable signal and power transfer between parallel circuit boards. Its innovative contact system provides stable electrical characteristics across thousands of mating cycles. The connector's compact footprint makes it ideal for space-constrained designs in consumer electronics, including gaming consoles and smart home devices. Industrial applications benefit from its vibration-resistant properties in factory automation equipment and process control systems. The QRF8-078-05.0-L-D-A-GP also serves critical roles in medical diagnostic equipment and aerospace instrumentation. Features include enhanced current-carrying capacity, optimized signal paths, and durable housing materials. The connector's low-profile design facilitates thermal management in densely packed electronic assemblies. For OEMs requiring consistent interconnect performance, this solution offers reliable alternatives to conventional board stacking methods. Submit your project requirements through our online inquiry system to receive customized connector recommendations.
General specs
- Product Status: Active
- Connector Type: Array, Female Sockets
- Number of Positions: 156
- Pitch: 0.031" (0.80mm)
- Number of Rows: 2
- Mounting Type: Surface Mount
- Features: Board Guide, Ground Bus (Plane)
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Mated Stacking Heights: 7mm, 10mm, 12mm
- Height Above Board: 0.197" (5.00mm)
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