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QMSS-048-06.75-L-D-DP-PC4

Samtec Inc.
QMSS-048-06.75-L-D-DP-PC4 Preview
Samtec Inc.
CONN DIFF ARRAY PLG 96P SMD GOLD
$43.41
Available to order
Reference Price (USD)
1+
$27.71000
Exquisite packaging
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Samtec Inc. QMSS-048-06.75-L-D-DP-PC4 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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QMSS-048-06.75-L-D-DP-PC4

QMSS-048-06.75-L-D-DP-PC4

$43.41

Product details

Samtec Inc.'s QMSS-048-06.75-L-D-DP-PC4 edge-type mezzanine connector delivers uncompromising performance in demanding board-to-board applications. This rectangular array solution combines high contact density with reliable power distribution capabilities. The precision-engineered contact system ensures minimal insertion loss and stable impedance characteristics. Suitable for high-vibration environments, the connector maintains secure connections in transportation systems and heavy machinery electronics. Its robust construction meets rigorous industrial standards for shock and impact resistance. The QMSS-048-06.75-L-D-DP-PC4 finds extensive use in energy management systems, industrial computing platforms, and defense electronics. The connector's optimized pin arrangement supports mixed-signal transmission with effective noise isolation. Key benefits include extended service life, simplified assembly processes, and compatibility with automated placement equipment. For applications requiring dependable inter-board connections in harsh conditions, this connector series provides proven solutions. Access technical documentation and request samples by completing our brief online inquiry form.

General specs

  • Product Status: Active
  • Connector Type: Differential Pair Array, Male
  • Number of Positions: 96
  • Pitch: 0.025" (0.64mm)
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • Features: Board Guide, Ground Bus (Plane), Power Pins (4), Shielded
  • Contact Finish: Gold
  • Contact Finish Thickness: 10.0µin (0.25µm)
  • Mated Stacking Heights: 11mm
  • Height Above Board: 0.265" (6.73mm)

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