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MIT-057-01-L-D-K-TR

Samtec Inc.
MIT-057-01-L-D-K-TR Preview
Samtec Inc.
0.635 MM MIXED TECHNOLOGY HIGH-S
$11.15
Available to order
Reference Price (USD)
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$11.14838
500+
$11.0368962
1000+
$10.9254124
1500+
$10.8139286
2000+
$10.7024448
2500+
$10.590961
Exquisite packaging
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Samtec Inc. MIT-057-01-L-D-K-TR is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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MIT-057-01-L-D-K-TR

MIT-057-01-L-D-K-TR

$11.15

Product details

The MIT-057-01-L-D-K-TR board-to-board connector by Samtec Inc. sets new standards in rectangular array interconnect technology. Designed for edge-type mezzanine applications, this high-density solution enables reliable signal and power transfer between parallel circuit boards. Its innovative contact system provides stable electrical characteristics across thousands of mating cycles. The connector's compact footprint makes it ideal for space-constrained designs in consumer electronics, including gaming consoles and smart home devices. Industrial applications benefit from its vibration-resistant properties in factory automation equipment and process control systems. The MIT-057-01-L-D-K-TR also serves critical roles in medical diagnostic equipment and aerospace instrumentation. Features include enhanced current-carrying capacity, optimized signal paths, and durable housing materials. The connector's low-profile design facilitates thermal management in densely packed electronic assemblies. For OEMs requiring consistent interconnect performance, this solution offers reliable alternatives to conventional board stacking methods. Submit your project requirements through our online inquiry system to receive customized connector recommendations.

General specs

  • Product Status: Active
  • Connector Type: Header, Outer Shroud Contacts
  • Number of Positions: 114
  • Pitch: 0.025" (0.64mm)
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • Features: Board Guide, Ground Bus (Plane), Pick and Place
  • Contact Finish: Gold
  • Contact Finish Thickness: 10.0µin (0.25µm)
  • Mated Stacking Heights: -
  • Height Above Board: -

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