ICF-308-T-O
Samtec Inc.
Samtec Inc.
CONN IC DIP SOCKET 8POS TIN
$1.91
Available to order
Reference Price (USD)
1+
$1.91000
500+
$1.8909
1000+
$1.8718
1500+
$1.8527
2000+
$1.8336
2500+
$1.8145
Exquisite packaging
Discount
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| EMS | 3-7 days |
Samtec Inc. ICF-308-T-O is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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Product details
The ICF-308-T-O by Samtec Inc. redefines reliability in IC and transistor sockets, offering cutting-edge technology for modern electronic applications. This precision-engineered socket features gold-plated contacts for optimal conductivity and corrosion resistance, ensuring long-term performance stability. Its unique design accommodates various package types while maintaining consistent contact pressure across all pins. The ICF-308-T-O excels in applications requiring high-speed data transmission and minimal signal loss, such as server farms, 5G infrastructure, and advanced computing systems. Additional benefits include easy visual inspection points and color-coded orientation indicators for foolproof installation. Manufactured to withstand rigorous use, this socket is equally at home in laboratory equipment, marine electronics, and agricultural automation systems. Samtec Inc.'s commitment to innovation shines through in every detail of the ICF-308-T-O, providing engineers with a trusted solution for their most demanding projects. Don't settle for ordinary sockets explore the advanced features of the ICF-308-T-O today. Click to request a sample or get instant pricing information from our sales team.
General specs
- Product Status: Active
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -55°C ~ 125°C
