BSP-226769-01
Samtec Inc.
Samtec Inc.
XCEDE HD DAUGHTER CARD ASSEMBLY
$34.69
Available to order
Reference Price (USD)
1+
$34.69000
500+
$34.3431
1000+
$33.9962
1500+
$33.6493
2000+
$33.3024
2500+
$32.9555
Exquisite packaging
Discount
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| DHL / Fedex / UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
Samtec Inc. BSP-226769-01 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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BSP-226769-01
$34.69
Product details
Introducing the BSP-226769-01, a cutting-edge backplane connector by Samtec Inc., built for specialized high-speed applications. This connector excels in environments requiring low latency and high bandwidth, such as 5G infrastructure, autonomous vehicles, and AI-driven systems. Its high-density design maximizes connectivity without sacrificing performance. The BSP-226769-01 is engineered to reduce crosstalk and signal loss, ensuring reliable data transmission. Industries worldwide trust this connector for its precision and durability. Take your projects to the next level with the BSP-226769-01. Visit our online catalog or contact our sales representatives for pricing and delivery options.
General specs
- Product Status: Active
- Connector Usage: Daughtercard
- Connector Type: Receptacle, Female Sockets and Blade Sockets
- Connector Style: XCede®
- Number of Positions: -
- Number of Positions Loaded: -
- Pitch: 0.071" (1.80mm)
- Number of Rows: -
- Number of Columns: -
- Mounting Type: Through Hole, Right Angle
- Termination: -
- Contact Layout, Typical: -
- Features: -
- Contact Finish: -
- Contact Finish Thickness: -
- Color: -
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