RMLV0408EGSB-4S2#HA0
Renesas Electronics America Inc

Renesas Electronics America Inc
IC SRAM 4MBIT PARALLEL 32TSOP II
$13.31
Available to order
Reference Price (USD)
1,000+
$8.81790
Exquisite packaging
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Product details
Discover the RMLV0408EGSB-4S2#HA0 by Renesas Electronics America Inc, a high-efficiency memory IC engineered for next-generation computing platforms. This innovative solution delivers superior performance metrics, combining speed, capacity, and power optimization in a single package. Its architecture is tailored for both embedded and expandable memory applications.
The RMLV0408EGSB-4S2#HA0 features include dynamic frequency scaling, bank interleaving support, and thermal throttling capability. These advanced features enable optimal performance across various operating conditions. The memory IC offers excellent signal integrity at high speeds while maintaining low power consumption. Its design incorporates reliability enhancements for continuous operation.
Ideal applications include hyperscale data centers, AI inference accelerators, and autonomous mobile robots. The RMLV0408EGSB-4S2#HA0 is equally effective in virtual reality systems, genomic sequencing equipment, and quantum computing interfaces. Its capabilities extend to smart agriculture systems and renewable energy management platforms requiring high-performance memory solutions.
To learn more about integrating this Renesas Electronics America Inc memory IC into your design, submit your inquiry through our online portal. Our application engineers will provide technical support and procurement options for the RMLV0408EGSB-4S2#HA0, ensuring optimal memory performance for your specific requirements.
General specs
- Product Status: Obsolete
- Memory Type: Volatile
- Memory Format: SRAM
- Technology: SRAM
- Memory Size: 4Mb (512K x 8)
- Memory Interface: Parallel
- Clock Frequency: -
- Write Cycle Time - Word, Page: 45ns
- Access Time: 45 ns
- Voltage - Supply: 2.7V ~ 3.6V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 32-SOIC (0.400", 10.16mm Width)
- Supplier Device Package: 32-TSOP II