TH930-50G-4JAR
Penchem Technologies Sdn Bhd
Penchem Technologies Sdn Bhd
SILICONE THERMAL PUTTY
$20.50
Available to order
Reference Price (USD)
1+
$20.50000
500+
$20.295
1000+
$20.09
1500+
$19.885
2000+
$19.68
2500+
$19.475
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
| DHL / Fedex / UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
Penchem Technologies Sdn Bhd TH930-50G-4JAR is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
Experience hassle-free transactions with our flexible payment options and credit facilities. Learn more about the various payment methods accepted, installment plans, and any exclusive credit offers available to make your shopping experience seamless.
TH930-50G-4JAR
$20.50
Product details
Discover the TH930-50G-4JAR from Penchem Technologies Sdn Bhd, a versatile thermal epoxy adhesive designed for high-performance thermal management. This product, part of the Thermal - Adhesives, Epoxies, Greases, Pastes category, offers strong bonding and excellent heat transfer capabilities. The TH930-50G-4JAR is ideal for applications requiring durable adhesion and efficient thermal conductivity. Its formulation ensures reliable performance under extreme temperatures and mechanical stress, making it a preferred choice for demanding industries.
The TH930-50G-4JAR features fast curing times, reducing assembly downtime, and its high strength prevents component displacement. It is resistant to chemicals and moisture, ensuring longevity in harsh environments. The epoxy is electrically insulating, making it safe for use in electronic assemblies. Its ease of application and consistent performance make it a favorite among engineers and technicians.
Applications span across: 1) Bonding heat sinks in telecommunications equipment, 2) Securing components in renewable energy systems, and 3) Assembling medical devices requiring precise thermal management. The TH930-50G-4JAR delivers unmatched reliability.
Optimize your thermal solutions with the TH930-50G-4JAR. Get in touch with Penchem Technologies Sdn Bhd today to learn more about our products and request a customized quote. We re here to support your thermal management needs with expert advice and high-quality solutions.
General specs
- Product Status: Active
- Type: Silicone Putty
- Size / Dimension: 50 gram Jar
- Usable Temperature Range: -76°F ~ 392°F (-60°C ~ 200°C)
- Color: White
- Thermal Conductivity: 5.00W/m-K
- Features: -
- Shelf Life: 18 Months
- Storage/Refrigeration Temperature: -
Viewed products
