TH235-2-50G-4JAR
Penchem Technologies Sdn Bhd

Penchem Technologies Sdn Bhd
NON SILICONE THERMAL PUTTY
$20.00
Available to order
Reference Price (USD)
1+
$20.00000
500+
$19.8
1000+
$19.6
1500+
$19.4
2000+
$19.2
2500+
$19
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
DHL / Fedex / UPS | 2-5 days |
TNT | 2-6 days |
EMS | 3-7 days |
Penchem Technologies Sdn Bhd TH235-2-50G-4JAR is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
Experience hassle-free transactions with our flexible payment options and credit facilities. Learn more about the various payment methods accepted, installment plans, and any exclusive credit offers available to make your shopping experience seamless.
Product details
Introducing the TH235-2-50G-4JAR from Penchem Technologies Sdn Bhd, a high-performance thermal adhesive tape designed for efficient heat management. Part of the Thermal - Adhesives, Epoxies, Greases, Pastes category, this tape offers strong adhesion and excellent thermal conductivity. The TH235-2-50G-4JAR is perfect for applications where traditional thermal interface materials are impractical. Its flexible design allows for easy application on uneven surfaces, ensuring optimal thermal transfer.
The TH235-2-50G-4JAR features a pressure-sensitive adhesive that bonds instantly, eliminating the need for curing time. It is electrically insulating and resistant to moisture, making it suitable for electronic assemblies. The tape maintains its performance under high temperatures and mechanical stress, providing reliable thermal management in various environments.
Common applications include: 1) Mounting heat sinks in compact electronic devices, 2) Securing thermal pads in automotive systems, and 3) Bonding components in aerospace electronics. The TH235-2-50G-4JAR is a versatile solution for modern thermal challenges.
Streamline your thermal management with the TH235-2-50G-4JAR. Reach out to Penchem Technologies Sdn Bhd today to request a quote or learn more about our product offerings. We re committed to providing innovative solutions tailored to your requirements.
General specs
- Product Status: Active
- Type: Non-Silicone Putty
- Size / Dimension: 50 gram Jar
- Usable Temperature Range: 5°F ~ 248°F (-15°C ~ 200°C)
- Color: Blue
- Thermal Conductivity: 4.00W/m-K
- Features: -
- Shelf Life: 18 Months
- Storage/Refrigeration Temperature: -