BU400Z-178-HT
On Shore Technology Inc.
On Shore Technology Inc.
CONN IC DIP SOCKET 40POS GOLD
$0.00
Available to order
Reference Price (USD)
1+
$6.98000
10+
$6.69300
30+
$6.11100
50+
$5.82000
100+
$5.52900
250+
$4.94700
500+
$4.65600
1,000+
$4.07400
2,500+
$3.87030
Exquisite packaging
Discount
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| TNT | 2-6 days |
| EMS | 3-7 days |
On Shore Technology Inc. BU400Z-178-HT is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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BU400Z-178-HT
$0.00
Product details
The BU400Z-178-HT by On Shore Technology Inc. sets new benchmarks for IC and transistor sockets, offering exceptional quality and innovative features. This socket's precision-machined contacts provide gas-tight connections, preventing oxidation and ensuring consistent electrical performance over time. Its modular design allows for customization to specific pin counts and configurations, catering to diverse application requirements. The BU400Z-178-HT demonstrates outstanding performance in high-vibration environments like railway systems, wind turbines, and heavy construction equipment. Additional highlights include lead-free construction for environmental compliance and optional burn-in capabilities for quality assurance. Professionals in the semiconductor testing, power electronics, and automation industries particularly value this socket's reliability and precision. On Shore Technology Inc.'s rigorous testing protocols guarantee that every BU400Z-178-HT meets exacting standards before reaching your production line. Elevate your interconnect strategy with this superior socket solution reach out today for technical specifications and volume pricing options tailored to your project scope.
General specs
- Product Status: Obsolete
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 78.7µin (2.00µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Copper
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Brass
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -55°C ~ 125°C
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