BU160Z-178-HT
On Shore Technology Inc.
On Shore Technology Inc.
CONN IC DIP SOCKET 16POS GOLD
$2.37
Available to order
Reference Price (USD)
1+
$2.37000
10+
$2.14900
25+
$2.01720
50+
$1.92940
100+
$1.84170
250+
$1.66632
500+
$1.53476
1,000+
$1.31550
2,500+
$1.22780
Exquisite packaging
Discount
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| TNT | 2-6 days |
| EMS | 3-7 days |
On Shore Technology Inc. BU160Z-178-HT is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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BU160Z-178-HT
$2.37
Product details
Maximize your electronic system's potential with the BU160Z-178-HT from On Shore Technology Inc., a premium-quality socket designed for ICs and transistors. This socket combines advanced materials with precision engineering to deliver unmatched performance in compact packages. Its innovative contact design ensures reliable connections through thousands of insertion cycles, reducing maintenance needs and total cost of ownership. The BU160Z-178-HT features excellent EMI shielding properties, making it ideal for sensitive applications in medical imaging, avionics, and satellite communications. With its wide operating temperature range and resistance to environmental stressors, this socket performs flawlessly in both indoor and outdoor installations. The tool-less design allows for quick component swaps, significantly improving production efficiency. Trusted by engineers worldwide, On Shore Technology Inc.'s BU160Z-178-HT represents the gold standard in interconnect solutions. From prototype development to mass production, this socket adapts to your evolving needs. Take advantage of our expertise contact us now to discuss how the BU160Z-178-HT can enhance your product's reliability and performance.
General specs
- Product Status: Obsolete
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 78.7µin (2.00µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Copper
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Brass
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -55°C ~ 125°C
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