XR2A-2411-N
Omron Electronics Inc-EMC Div
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 24POS GOLD
$4.45
Available to order
Reference Price (USD)
1+
$3.53000
10+
$3.38600
25+
$3.10400
50+
$2.96300
100+
$2.82190
250+
$2.46912
500+
$2.39858
1,000+
$2.04585
2,500+
$2.03801
Exquisite packaging
Discount
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| EMS | 3-7 days |
Omron Electronics Inc-EMC Div XR2A-2411-N is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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XR2A-2411-N
$4.45
Product details
Experience superior connectivity with the XR2A-2411-N from Omron Electronics Inc-EMC Div, a high-grade socket specifically designed for ICs and transistors. This socket delivers exceptional electrical performance and mechanical stability, ensuring uninterrupted operation in even the most challenging environments. Its advanced contact technology guarantees low insertion force and high retention, protecting your components during installation and use. The XR2A-2411-N stands out with its resistance to vibration, temperature fluctuations, and chemical exposure, making it suitable for automotive control systems, industrial machinery, and IoT devices. The socket's innovative design allows for quick component changes, significantly reducing assembly time. Backed by Omron Electronics Inc-EMC Div's quality assurance, the XR2A-2411-N meets the highest industry standards for reliability and performance. Whether you're developing new products or maintaining existing systems, this socket offers the perfect balance of functionality and durability. Ready to source this essential component? Submit your inquiry now and our team will provide customized solutions for your specific requirements.
General specs
- Product Status: Active
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Operating Temperature: -55°C ~ 125°C
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