XB4B-2435-D
Omron Electronics Inc-EMC Div
Omron Electronics Inc-EMC Div
CONN SOCKET 24POS SMD GOLD
$0.47
Available to order
Reference Price (USD)
1+
$0.47000
500+
$0.4653
1000+
$0.4606
1500+
$0.4559
2000+
$0.4512
2500+
$0.4465
Exquisite packaging
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| EMS | 3-7 days |
Omron Electronics Inc-EMC Div XB4B-2435-D is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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XB4B-2435-D
$0.47
Product details
Discover the advanced connectivity solutions offered by Omron Electronics Inc-EMC Div's XB4B-2435-D rectangular array connector. Designed specifically for edge-type mezzanine applications, this board-to-board interconnect ensures reliable performance in high-density electronic systems. The connector features precision contacts that maintain stable electrical characteristics through repeated mating cycles. Its space-efficient design enables compact PCB stacking in telecommunications base stations and network switching equipment. The XB4B-2435-D also excels in industrial motor drives, renewable energy converters, and automotive ADAS modules. The connector's reinforced housing provides mechanical stability while allowing efficient heat dissipation. Special contact plating options ensure compatibility with various environmental conditions. With its optimized signal integrity and power delivery capabilities, this connector series supports next-generation electronic designs. Engineers appreciate its foolproof polarization features that prevent misalignment during assembly. For detailed product information and volume pricing options, please submit your requirements through our convenient online inquiry system.
General specs
- Product Status: Obsolete
- Connector Type: Socket, Outer Shroud Contacts
- Number of Positions: 24
- Pitch: 0.016" (0.40mm)
- Number of Rows: 2
- Mounting Type: Surface Mount
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 5.90µin (0.150µm)
- Mated Stacking Heights: 0.9mm
- Height Above Board: 0.033" (0.84mm)
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