BGAH310-075E
Ohmite

Ohmite
BGA HEATSINK W/TAPE
$6.65
Available to order
Reference Price (USD)
1+
$6.65000
500+
$6.5835
1000+
$6.517
1500+
$6.4505
2000+
$6.384
2500+
$6.3175
Exquisite packaging
Discount
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TNT | 2-6 days |
EMS | 3-7 days |
Ohmite BGAH310-075E is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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Product details
Enhance your thermal management system with the BGAH310-075E heat sink from Ohmite, a top-tier solution designed for superior heat dissipation. This heat sink excels in environments where maintaining optimal temperatures is crucial for performance and longevity. Its innovative design maximizes surface area to improve airflow and heat transfer, ensuring efficient cooling even under heavy loads. The BGAH310-075E is built to withstand harsh conditions, making it suitable for a wide range of industrial applications. From data centers to power electronics, this heat sink provides reliable thermal regulation to prevent overheating and extend equipment life. The automotive industry can leverage its cooling capabilities for electric vehicle components, while the manufacturing sector can use it to protect machinery from thermal stress. Additionally, the BGAH310-075E is ideal for LED lighting systems, where effective heat management is key to maintaining brightness and efficiency. Ohmite has engineered this heat sink with a focus on durability and performance, ensuring it meets the rigorous demands of modern industries. Its lightweight yet sturdy construction allows for easy installation without compromising on strength. For businesses looking to improve their thermal management strategies, the BGAH310-075E offers a proven solution backed by Ohmite's expertise. Don't let heat-related issues disrupt your operations reach out to us today to request a quote and discover how this heat sink can benefit your application.
General specs
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA, CPU, GPU
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Angled Fins
- Length: 1.220" (31.00mm)
- Width: 1.220" (31.00mm)
- Diameter: -
- Fin Height: 0.295" (7.50mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: 6.30°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized