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NX3L2267SGU,115

NXP USA Inc.
NX3L2267SGU,115 Preview
NXP USA Inc.
IC ANALOG SWITCH SPDT 10XQFN
$1.02
Available to order
Reference Price (USD)
4,000+
$0.35583
8,000+
$0.33129
12,000+
$0.32638
Exquisite packaging
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NX3L2267SGU,115

NX3L2267SGU,115

$1.02

Product details

The NX3L2267SGU,115 from NXP USA Inc. redefines analog signal switching in the Interface ICs market. This advanced switch matrix provides configurable signal paths with minimal insertion loss and distortion. Its architecture supports both single-ended and differential signals, accommodating diverse system requirements. Key advantages include fast settling time and excellent linearity across the entire signal range. The product is particularly valuable in automated test equipment, telecommunications infrastructure, and audio processing systems. With its industry-leading crosstalk rejection, the NX3L2267SGU,115 maintains signal integrity in dense PCB layouts. The device's low power operation makes it suitable for energy-conscious designs. NXP USA Inc. backs this product with extensive technical documentation and design support tools. Visit our website to access datasheets, evaluation board information, and design calculators. For immediate assistance with your project, use our online contact form to connect with application engineers.

General specs

  • Product Status: Active
  • Switch Circuit: SPDT
  • Multiplexer/Demultiplexer Circuit: 2:1
  • Number of Circuits: 2
  • On-State Resistance (Max): 750mOhm
  • Channel-to-Channel Matching (ΔRon): 90mOhm
  • Voltage - Supply, Single (V+): 1.4V ~ 4.3V
  • Voltage - Supply, Dual (V±): -
  • Switch Time (Ton, Toff) (Max): 40ns, 20ns
  • -3db Bandwidth: 60MHz
  • Charge Injection: 37pC
  • Channel Capacitance (CS(off), CD(off)): 35pF
  • Current - Leakage (IS(off)) (Max): 10nA
  • Crosstalk: -90dB @ 100kHz
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 10-XFQFN
  • Supplier Device Package: 10-XQFN (1.4x1.8)

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