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SY89872UMG

Microchip Technology
SY89872UMG Preview
Microchip Technology
IC CLK BUFFER 1:3 2GHZ 16MLF
$12.91
Available to order
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SY89872UMG

SY89872UMG

$12.91

Product details

Introducing the SY89872UMG from Microchip Technology, a cutting-edge clock buffer designed for high-reliability timing solutions. This IC ensures precise clock distribution across multiple outputs, making it indispensable for systems demanding synchronized operations. With its low-phase noise and high-speed performance, the SY89872UMG is perfect for applications where timing accuracy is non-negotiable. The device features a compact footprint, enabling integration into space-constrained designs without compromising functionality. Key attributes include ultra-low jitter, wide operating voltage range, and thermal stability. The SY89872UMG is built to withstand electromagnetic interference, ensuring consistent performance in noisy environments. Its flexible design supports various clock formats, catering to diverse application needs. From telecommunications to industrial automation, this clock buffer delivers unmatched precision. Applications include base stations for cellular networks, where timing synchronization is vital, automotive infotainment systems requiring seamless audio/video synchronization, and industrial robotics for precise motion control. The SY89872UMG is also ideal for scientific instruments, where accurate timing is crucial for data acquisition. Take the next step in your design journey. Request a sample or quote for the SY89872UMG today and experience the difference in clock timing performance.

General specs

  • Product Status: Active
  • Type: Fanout Buffer (Distribution), Divider
  • Number of Circuits: 1
  • Ratio - Input:Output: 1:3
  • Differential - Input:Output: Yes/Yes
  • Input: CML, HSTL, LVDS, LVPECL
  • Output: LVDS
  • Frequency - Max: 2 GHz
  • Voltage - Supply: 2.375V ~ 2.625V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
  • Supplier Device Package: 16-MLF® (3x3)

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