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AX01R080VABBR600

JAE Electronics
AX01R080VABBR600 Preview
JAE Electronics
RIGID SIDE B2B CONNECTOR, 80 POS
$7.06
Available to order
Reference Price (USD)
1+
$7.06000
500+
$6.9894
1000+
$6.9188
1500+
$6.8482
2000+
$6.7776
2500+
$6.707
Exquisite packaging
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DHL / Fedex / UPS 2-5 days
TNT 2-6 days
EMS 3-7 days

JAE Electronics AX01R080VABBR600 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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AX01R080VABBR600

AX01R080VABBR600

$7.06

Product details

The AX01R080VABBR600 from JAE Electronics represents a premium edge-type mezzanine connector solution for critical board-to-board applications. This rectangular array connector delivers exceptional signal integrity and power transmission in compact electronic assemblies. Its advanced contact geometry ensures reliable connections in medical imaging systems, semiconductor test equipment, and industrial control units. The connector's robust construction withstands mechanical stress in transportation and aerospace electronics. Features include enhanced current-carrying capacity, optimized contact resistance, and vibration-resistant mating interfaces. The AX01R080VABBR600 supports high-speed data transmission while maintaining excellent EMI/RFI shielding characteristics. Its modular design allows flexible configuration for different stack heights and pin counts. Common implementations include server backplane connections, power supply modules, and instrumentation clusters. The connector's durable materials ensure long-term reliability in challenging operating environments. For technical specifications and application support regarding this high-performance interconnect solution, please complete our online inquiry form.

General specs

  • Product Status: Active
  • Connector Type: Plug, Outer Shroud Contacts
  • Number of Positions: 80
  • Pitch: 0.025" (0.64mm)
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • Features: Board Guide, Solder Retention
  • Contact Finish: Gold
  • Contact Finish Thickness: 4.00µin (0.100µm)
  • Mated Stacking Heights: -
  • Height Above Board: 0.260" (6.60mm)

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