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AX01F080VABBR300

JAE Electronics
AX01F080VABBR300 Preview
JAE Electronics
FLOATING SIDE B2B CONNECTOR, 80
$7.41
Available to order
Reference Price (USD)
1+
$7.41000
500+
$7.3359
1000+
$7.2618
1500+
$7.1877
2000+
$7.1136
2500+
$7.0395
Exquisite packaging
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JAE Electronics AX01F080VABBR300 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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AX01F080VABBR300

AX01F080VABBR300

$7.41

Product details

The AX01F080VABBR300 rectangular array connector by JAE Electronics provides superior edge-type mezzanine connectivity for advanced electronic systems. Designed for board-to-board applications, this high-density solution ensures reliable signal transmission and power delivery. Its innovative contact design maintains stable electrical characteristics in industrial robotics, process control equipment, and test measurement systems. The connector's robust construction withstands harsh environmental conditions encountered in transportation and energy applications. Features include enhanced EMI shielding, vibration-resistant mating interfaces, and optimized current-carrying capacity. The AX01F080VABBR300 supports various stack heights between parallel boards, offering design flexibility for different system architectures. Its space-saving profile facilitates thermal management in densely packed electronic assemblies. Common implementations include server backplanes, power supply modules, and instrumentation clusters. For OEMs requiring consistent interconnect performance, this solution offers reliable alternatives to conventional board stacking methods. Submit your project requirements through our online inquiry system to receive customized connector recommendations.

General specs

  • Product Status: Active
  • Connector Type: Receptacle, Center Strip Contacts
  • Number of Positions: 80
  • Pitch: 0.025" (0.64mm)
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • Features: Board Guide, Solder Retention
  • Contact Finish: Gold
  • Contact Finish Thickness: 4.00µin (0.100µm)
  • Mated Stacking Heights: -
  • Height Above Board: 0.484" (12.29mm)

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