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AX01F030VABBR300

JAE Electronics
AX01F030VABBR300 Preview
JAE Electronics
FLOATING SIDE B2B CONNECTOR, 30
$4.58
Available to order
Reference Price (USD)
1+
$4.58000
500+
$4.5342
1000+
$4.4884
1500+
$4.4426
2000+
$4.3968
2500+
$4.351
Exquisite packaging
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EMS 3-7 days

JAE Electronics AX01F030VABBR300 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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AX01F030VABBR300

AX01F030VABBR300

$4.58

Product details

The AX01F030VABBR300 board-to-board connector by JAE Electronics sets new standards in rectangular array interconnect technology. Designed for edge-type mezzanine applications, this high-density solution enables reliable signal and power transfer between parallel circuit boards. Its innovative contact system provides stable electrical characteristics across thousands of mating cycles. The connector's compact footprint makes it ideal for space-constrained designs in consumer electronics, including gaming consoles and smart home devices. Industrial applications benefit from its vibration-resistant properties in factory automation equipment and process control systems. The AX01F030VABBR300 also serves critical roles in medical diagnostic equipment and aerospace instrumentation. Features include enhanced current-carrying capacity, optimized signal paths, and durable housing materials. The connector's low-profile design facilitates thermal management in densely packed electronic assemblies. For OEMs requiring consistent interconnect performance, this solution offers reliable alternatives to conventional board stacking methods. Submit your project requirements through our online inquiry system to receive customized connector recommendations.

General specs

  • Product Status: Active
  • Connector Type: Receptacle, Center Strip Contacts
  • Number of Positions: 30
  • Pitch: 0.025" (0.64mm)
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • Features: Board Guide, Solder Retention
  • Contact Finish: Gold
  • Contact Finish Thickness: 4.00µin (0.100µm)
  • Mated Stacking Heights: -
  • Height Above Board: 0.484" (12.29mm)

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