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IW-HSKALU-CLASLR-CU02

iWave Systems
IW-HSKALU-CLASLR-CU02 Preview
iWave Systems
ARRIA10 SOC SOM HEATSINK
$43.20
Available to order
Reference Price (USD)
1+
$43.20000
500+
$42.768
1000+
$42.336
1500+
$41.904
2000+
$41.472
2500+
$41.04
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iWave Systems IW-HSKALU-CLASLR-CU02 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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IW-HSKALU-CLASLR-CU02

IW-HSKALU-CLASLR-CU02

$43.20

Product details

Discover the IW-HSKALU-CLASLR-CU02 thermal heat sink from iWave Systems, a high-performance solution designed to meet the demanding cooling needs of modern industries. This heat sink is engineered for superior heat dissipation, ensuring reliable thermal management in high-power applications. Its robust construction and advanced design make it an ideal choice for industries such as automotive, aerospace, and renewable energy. In the automotive sector, the IW-HSKALU-CLASLR-CU02 provides essential cooling for electric vehicle batteries and power electronics. Aerospace applications benefit from its ability to maintain optimal temperatures in avionics and other critical systems. The renewable energy industry also relies on its efficient cooling capabilities for solar inverters and wind turbine components. iWave Systems has crafted this heat sink with precision, using high-quality materials to ensure durability and long-term performance. Its innovative fin design maximizes surface area for improved heat transfer, making it a standout choice for engineers and designers. For businesses seeking a dependable thermal solution, the IW-HSKALU-CLASLR-CU02 delivers the performance and reliability you need. Whether you're in the manufacturing, telecommunications, or medical device industry, this heat sink can help you achieve better thermal efficiency. Ready to upgrade your cooling system? Contact us today to request a quote and discover how the IW-HSKALU-CLASLR-CU02 can meet your specific needs.

General specs

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: FPGA
  • Attachment Method: Bolt On
  • Shape: Rectangular, Fins
  • Length: 3.740" (95.00mm)
  • Width: 2.953" (75.00mm)
  • Diameter: -
  • Fin Height: 1.181" (30.00mm)
  • Power Dissipation @ Temperature Rise: -
  • Thermal Resistance @ Forced Air Flow: -
  • Thermal Resistance @ Natural: -
  • Material: Aluminum
  • Material Finish: -

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