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IW-FSKALU-CLASLR-CU01

iWave Systems
IW-FSKALU-CLASLR-CU01 Preview
iWave Systems
ARRIA10 SOC SOM FANSINK
$49.08
Available to order
Reference Price (USD)
1+
$49.08000
500+
$48.5892
1000+
$48.0984
1500+
$47.6076
2000+
$47.1168
2500+
$46.626
Exquisite packaging
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EMS 3-7 days

iWave Systems IW-FSKALU-CLASLR-CU01 is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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IW-FSKALU-CLASLR-CU01

IW-FSKALU-CLASLR-CU01

$49.08

Product details

The IW-FSKALU-CLASLR-CU01 thermal heat sink from iWave Systems is a high-performance cooling solution designed to meet the needs of modern industries. Its advanced design ensures efficient heat dissipation, making it ideal for high-power applications where temperature control is critical. The IW-FSKALU-CLASLR-CU01 is built to last, with a robust construction that withstands harsh environments and heavy loads. Industries such as automotive, aerospace, and telecommunications can benefit from its superior thermal management capabilities. In the automotive sector, it is perfect for cooling electric vehicle components, while in aerospace, it ensures the reliability of avionics systems. Telecommunications equipment also benefits from its ability to maintain stable temperatures in networking gear and base stations. iWave Systems has crafted this heat sink with precision, using high-quality materials to ensure durability and long-term performance. Its innovative fin design enhances heat transfer, making it a standout choice for engineers and designers. For businesses looking to enhance their cooling strategies, the IW-FSKALU-CLASLR-CU01 offers a proven solution backed by iWave Systems's expertise. Don't let heat-related issues impact your operations reach out to us today to request a quote and learn how this heat sink can benefit your application.

General specs

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: FPGA
  • Attachment Method: Bolt On
  • Shape: Rectangular, Fins
  • Length: 3.740" (95.00mm)
  • Width: 2.953" (75.00mm)
  • Diameter: -
  • Fin Height: 0.957" (24.31mm)
  • Power Dissipation @ Temperature Rise: -
  • Thermal Resistance @ Forced Air Flow: -
  • Thermal Resistance @ Natural: -
  • Material: Aluminum Alloy
  • Material Finish: Clear, Anodized

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