CY7C2565XV18-600BZC
Infineon Technologies
Infineon Technologies
IC SRAM 72MBIT PARALLEL 165FBGA
$535.64
Available to order
Reference Price (USD)
136+
$368.14676
Exquisite packaging
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CY7C2565XV18-600BZC
$535.64
Product details
Infineon Technologies's CY7C2565XV18-600BZC memory IC sets new standards in non-volatile storage technology, delivering robust performance for mission-critical applications. This memory solution offers the perfect balance of speed, capacity, and reliability, engineered to meet the evolving needs of modern electronics. Its architecture ensures data persistence without constant power supply.
The CY7C2565XV18-600BZC features include advanced wear-leveling algorithms, error correction capabilities, and wide temperature operation range. These attributes make it particularly valuable for applications requiring long-term data retention and consistent performance. The memory IC supports various interface protocols, enabling easy integration into existing system designs.
Primary applications include automotive telematics systems, industrial programmable logic controllers, and smart grid infrastructure. The CY7C2565XV18-600BZC is also ideal for wearable health monitors, digital signage solutions, and edge computing devices. Its reliability makes it suitable for aerospace black box recorders and underground mining equipment.
Discover the full potential of this Infineon Technologies memory IC by submitting your inquiry through our online portal. Our sales team will provide detailed specifications and competitive pricing options for the CY7C2565XV18-600BZC to meet your project timeline and budget requirements.
General specs
- Product Status: Active
- Memory Type: Volatile
- Memory Format: SRAM
- Technology: SRAM - Synchronous, QDR II+
- Memory Size: 72Mb (2M x 36)
- Memory Interface: Parallel
- Clock Frequency: 600 MHz
- Write Cycle Time - Word, Page: -
- Access Time: -
- Voltage - Supply: 1.7V ~ 1.9V
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 165-LBGA
- Supplier Device Package: 165-FBGA (13x15)
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