CY7C1270KV18-400BZXI
Infineon Technologies
Infineon Technologies
IC SRAM 36MBIT PARALLEL 165FBGA
$64.20
Available to order
Reference Price (USD)
136+
$46.66243
Exquisite packaging
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CY7C1270KV18-400BZXI
$64.20
Product details
Optimize your system's memory performance with the CY7C1270KV18-400BZXI from Infineon Technologies, a versatile IC solution for diverse storage requirements. This memory product offers an ideal combination of speed, density, and power efficiency, suitable for both volatile and non-volatile applications. Its flexible architecture supports various system configurations.
The CY7C1270KV18-400BZXI features include burst mode operation, low-latency access, and configurable I/O options. These capabilities enable efficient data handling in performance-sensitive applications. The memory IC demonstrates excellent thermal characteristics, ensuring reliable operation in high-temperature environments. Its design incorporates noise reduction techniques for signal integrity.
Application areas include server memory modules, graphics processing units, and network switches. The CY7C1270KV18-400BZXI is equally effective in digital cameras, gaming consoles, and audio processing equipment. Industrial applications include CNC machinery, test and measurement systems, and building automation controllers requiring dependable memory solutions.
Request detailed information about this Infineon Technologies memory IC by submitting an online inquiry. Our team provides comprehensive support from technical consultation to volume procurement of the CY7C1270KV18-400BZXI, ensuring optimal memory solutions for your specific needs.
General specs
- Product Status: Active
- Memory Type: Volatile
- Memory Format: SRAM
- Technology: SRAM - Synchronous, DDR II+
- Memory Size: 36Mb (1M x 36)
- Memory Interface: Parallel
- Clock Frequency: 400 MHz
- Write Cycle Time - Word, Page: -
- Access Time: -
- Voltage - Supply: 1.7V ~ 1.9V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 165-LBGA
- Supplier Device Package: 165-FBGA (13x15)
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