KN13C0.7-30DS-0.4V(895)
Hirose Electric Co Ltd
Hirose Electric Co Ltd
CONN 0.4MM SMD RCPT 30POS
$0.77
Available to order
Reference Price (USD)
1+
$0.77280
500+
$0.765072
1000+
$0.757344
1500+
$0.749616
2000+
$0.741888
2500+
$0.73416
Exquisite packaging
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| EMS | 3-7 days |
Hirose Electric Co Ltd KN13C0.7-30DS-0.4V(895) is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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KN13C0.7-30DS-0.4V(895)
$0.77
Product details
Engineered for mission-critical applications, Hirose Electric Co Ltd's KN13C0.7-30DS-0.4V(895) edge-type mezzanine connector delivers exceptional performance in rectangular array configurations. This board-to-board solution combines high contact density with reliable power distribution capabilities. The precision contacts ensure minimal insertion loss and stable impedance characteristics for high-speed data transmission. Ideal for aerospace avionics, defense systems, and industrial automation equipment, the connector maintains secure connections in high-vibration environments. Its robust construction meets stringent requirements for shock and impact resistance. The KN13C0.7-30DS-0.4V(895) finds extensive use in energy management systems, medical imaging devices, and telecommunications infrastructure. The optimized pin arrangement supports mixed-signal transmission with effective noise isolation. Key benefits include extended service life, simplified assembly processes, and compatibility with automated placement equipment. For applications demanding dependable inter-board connections, this connector series provides proven solutions. Request technical documentation and pricing information by completing our brief online inquiry form.
General specs
- Product Status: Active
- Connector Type: Receptacle, Center Strip Contacts
- Number of Positions: 30
- Pitch: 0.016" (0.40mm)
- Number of Rows: 2
- Mounting Type: Surface Mount
- Features: Pick and Place, Solder Retention
- Contact Finish: Gold
- Contact Finish Thickness: 1.97µin (0.050µm)
- Mated Stacking Heights: 0.7mm
- Height Above Board: 0.028" (0.71mm)
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