KN13C0.7-30DP-0.4V(800)
Hirose Electric Co Ltd
Hirose Electric Co Ltd
CONN 0.4MM SMD HDR 30POS
$1.29
Available to order
Reference Price (USD)
1+
$1.29000
500+
$1.2771
1000+
$1.2642
1500+
$1.2513
2000+
$1.2384
2500+
$1.2255
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Hirose Electric Co Ltd KN13C0.7-30DP-0.4V(800) is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
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KN13C0.7-30DP-0.4V(800)
$1.29
Product details
Engineered for precision connectivity, the KN13C0.7-30DP-0.4V(800) mezzanine connector from Hirose Electric Co Ltd provides superior board-to-board interconnection in mission-critical systems. This edge-type rectangular array features optimized contact spacing for high-speed data transmission while preventing crosstalk. The connector's reinforced housing structure withstands mechanical stress in industrial applications. Key advantages include enhanced signal integrity, reduced electromagnetic interference, and improved power distribution across connected boards. The KN13C0.7-30DP-0.4V(800) is particularly effective in automotive electronics modules, renewable energy inverters, and industrial IoT gateway devices. Its temperature-resistant materials maintain performance across extended environmental ranges. The polarized design ensures foolproof mating alignment during assembly processes. This connector series supports various stack heights between parallel boards, offering design flexibility for different system architectures. For high-reliability applications demanding consistent electrical performance, the KN13C0.7-30DP-0.4V(800) delivers optimal connectivity solutions. Visit our product page and use the inquiry form to request detailed specifications and pricing information.
General specs
- Product Status: Active
- Connector Type: Header, Outer Shroud Contacts
- Number of Positions: 30
- Pitch: 0.016" (0.40mm)
- Number of Rows: 2
- Mounting Type: Surface Mount
- Features: Pick and Place, Solder Retention
- Contact Finish: Gold
- Contact Finish Thickness: 1.97µin (0.050µm)
- Mated Stacking Heights: 0.7mm
- Height Above Board: 0.022" (0.57mm)
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