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FX11A-100P/10-SV(71)

Hirose Electric Co Ltd
FX11A-100P/10-SV(71) Preview
Hirose Electric Co Ltd
CONN HDR 100POS SMD GOLD
$5.83
Available to order
Reference Price (USD)
1+
$4.98000
20+
$4.77600
40+
$4.37800
60+
$4.17900
100+
$3.98000
260+
$3.48250
Exquisite packaging
Discount
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EMS 3-7 days

Hirose Electric Co Ltd FX11A-100P/10-SV(71) is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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FX11A-100P/10-SV(71)

FX11A-100P/10-SV(71)

$5.83

Product details

Hirose Electric Co Ltd's FX11A-100P/10-SV(71) represents an advanced edge-type mezzanine connector solution for high-density board-to-board connections. This rectangular array connector delivers exceptional electrical performance in compact electronic systems. The innovative contact design ensures low insertion loss and minimal signal distortion across high-speed data channels. With its precision-molded housing and optimized contact geometry, the FX11A-100P/10-SV(71) achieves reliable connections even in vibration-prone environments. The connector features a secure latching mechanism that maintains positive engagement throughout product lifespan. Typical implementations include military avionics systems, test and measurement equipment, and industrial robotics control units. Its space-saving profile enables efficient PCB stacking in rack-mounted server applications. The FX11A-100P/10-SV(71) supports both power and signal transmission in mixed-use configurations. For engineers seeking reliable inter-board connectivity solutions, this connector series offers versatile implementation options. Contact our sales team via the website inquiry form to discuss your specific application requirements.

General specs

  • Product Status: Active
  • Connector Type: Header, Outer Shroud Contacts
  • Number of Positions: 100
  • Pitch: 0.020" (0.50mm)
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • Features: Board Guide, Ground Plate, Solder Retention
  • Contact Finish: Gold
  • Contact Finish Thickness: 4.00µin (0.100µm)
  • Mated Stacking Heights: 2.5mm
  • Height Above Board: 0.084" (2.13mm)

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