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DF40TC(4.0)-30DS-0.4V(51)

Hirose Electric Co Ltd
DF40TC(4.0)-30DS-0.4V(51) Preview
Hirose Electric Co Ltd
CONN 0.4MM RCPT SMD 30POS
$0.74
Available to order
Reference Price (USD)
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$0.74025
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$0.7328475
1000+
$0.725445
1500+
$0.7180425
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$0.71064
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$0.7032375
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Hirose Electric Co Ltd DF40TC(4.0)-30DS-0.4V(51) is available at inksontech.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.

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DF40TC(4.0)-30DS-0.4V(51)

DF40TC(4.0)-30DS-0.4V(51)

$0.74

Product details

The DF40TC(4.0)-30DS-0.4V(51) from Hirose Electric Co Ltd represents a premium edge-type mezzanine connector solution for critical board-to-board applications. This rectangular array connector delivers exceptional signal integrity and power transmission in compact electronic assemblies. Its advanced contact geometry ensures reliable connections in medical imaging systems, semiconductor test equipment, and industrial control units. The connector's robust construction withstands mechanical stress in transportation and aerospace electronics. Features include enhanced current-carrying capacity, optimized contact resistance, and vibration-resistant mating interfaces. The DF40TC(4.0)-30DS-0.4V(51) supports high-speed data transmission while maintaining excellent EMI/RFI shielding characteristics. Its modular design allows flexible configuration for different stack heights and pin counts. Common implementations include server backplane connections, power supply modules, and instrumentation clusters. The connector's durable materials ensure long-term reliability in challenging operating environments. For technical specifications and application support regarding this high-performance interconnect solution, please complete our online inquiry form.

General specs

  • Product Status: Active
  • Connector Type: Receptacle, Center Strip Contacts
  • Number of Positions: 30
  • Pitch: 0.016" (0.40mm)
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • Features: Pick and Place, Solder Retention
  • Contact Finish: Gold
  • Contact Finish Thickness: 1.97µin (0.050µm)
  • Mated Stacking Heights: 4mm
  • Height Above Board: 0.154" (3.90mm)

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